Samsung New SAINT Tech Takes on TSMC in Chip Game
Samsung new SAINT tech. Samsung Electronics is getting ready to drop a fresh bomb in the chip world: SAINT. What’s SAINT, you ask? It’s short for Samsung Advance Interconnection Technology, a brand-new 3D chip packaging tech. And why’s it a big deal? Well, Samsung’s aiming high, eyeing Taiwan Semiconductor Manufacturing Company’s (TSMC) throne in the…
Read More “Samsung New SAINT Tech Takes on TSMC in Chip Game” »